Information:

• Wet processing of wafer / substrates / masks
• Cleaning, Developing, Striping, Etching, various chemical Processes incl. Piranha, HF, SC1 and SC2, Megasonic and Highpressure
• Stand alone and wet bench version
• Max. wafer size:Ø 12“ (Ø 300 mm) / Ø 600 mm / Ø 750 mm
• Customised chucks
• 200 programmable recipes

Information:

• Fully automated micro cluster system for process stations, e.g. Stripping Spin coater Developer Lift-Off Hot, cool and primer plates UV baking
• Max. wafer size: Ø 6“~ Ø 8“ ((Ø 150 ~ Ø 200 mm)
• Max. substrate size: 6“ x 6“ (150 mm x 150 mm
• Modular design for up to 6 process stations`

Information:

• Wet processing of wafer / substrates / masks
• Cleaning, Developing, Striping, Etching, various chemical Processes incl. Piranha, HF, SC1 and SC2, Megasonic and Highpressure
• Stand alone and wet bench version
• Max. wafer size:Ø 12“ (Ø 300 mm) / Ø 600 mm / Ø 750 mm
• Customised chucks
• 200 programmable recipes

Information:

• Fully automated micro cluster system for process stations, e.g. Stripping Spin coater Developer Lift-Off Hot, cool and primer plates UV baking
• Max. wafer size: Ø 6“~ Ø 8“ ((Ø 150 ~ Ø 200 mm)
• Max. substrate size: 6“ x 6“ (150 mm x 150 mm
• Modular design for up to 6 process stations`

Information:

• Spin coater with the patented Covered Chuck Technology
• Super homogeneous resist coating even on square substrates
• Max. wafer size:Ø 8“ (Ø 200 mm) Ø 600 mm Ø 12“ (Ø 300 mm) Ø 750 mm%Max. substrate size: 6" x 6“ (150 mm x 150 mm) 8" x 8“ (200 mm x 200 mm) 20“ x 20“ (500 mm x 500 mm) %200 Programmable recipes

Information:

• Fully automated micro cluster system for process stations, e.g. Stripping Spin coater Developer Lift-Off Hot, cool and primer plates UV baking

Information:

• Fully automated micro cluster system for process stations, e.g. Stripping Spin coater Developer Lift-Off Hot, cool and primer plates UV baking
• Ultra thin wafer handling (≥ 50 µm)
• Max. wafer size: Ø 12“ ((Ø 200 ~Ø 300 mm)
• For conductive and non-conductive resists
• Modular design for up to 3 process stations

Information:

• Spin coater with the patented Covered Chuck Technology
• Super homogeneous resist coating even on square substrates
• Max. wafer size:Ø 8“ (Ø 200 mm) Ø 600 mm Ø 12“ (Ø 300 mm) Ø 750 mm%Max. substrate size: 6" x 6“ (150 mm x 150 mm) 8" x 8“ (200 mm x 200 mm) 20“ x 20“ (500 mm x 500 mm) %200 Programmable recipes

Information:

• Fully automated micro cluster system for process stations, e.g. Stripping Spin coater Developer Lift-Off Hot, cool and primer plates UV baking

Information:

• Fully automated micro cluster system for process stations, e.g. Stripping Spin coater Developer Lift-Off Hot, cool and primer plates UV baking
• Ultra thin wafer handling (≥ 50 µm)
• Max. wafer size: Ø 12“ ((Ø 200 ~Ø 300 mm)
• For conductive and non-conductive resists
• Modular design for up to 3 process stations