Texturing

1

Diffusion

2

Polishing

3

Passivation

4

Testing

5

Auxiliary

Layout Size

  • W x D x H
  • 5000 X4400 X 2500 mm

Texturing loader and unloader

RTA-WTA-9000-18000

Information:

  • Model: RTA-WTA-9000-18000
  • Throughput:9000-18000
  • Breakage ratio:0.01%@166;0.02%@182;0.03%@210
  • Uptime: ≥ 99%
  • Double wafer detection
  • breakage inspection and crack detection
  • All-in-one welded steel frame%MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Batch Texturing Equipment

Information:

  • Model:ET-V8000/15000
  • Throughput : 8000-15000 pcs/hour
  • Breakage ratio:M10< 0.01%/M12< 0.02%
  • Uptime: >98%

Characteristics:

  • Alkaline texturing for PERC , TOPCon high efficiency solar cells
  • Texturing and cleaning with solar cell
  • Long bath lifetime design
  • Avoid cross-contamination and overtime
  • Upgrade related materials to avoid precipitation of impurities.

Layout Size

  • W x D x H
  • 9700 X 4500 X 2600 mm

Diffusion/Annealing/LPCVD loader and unloader

RTA-DIA12000-U-2R-12

Information:

  • Throughput:12000
  • Breakage ratio:0.01%@182;0.02%@210
  • Uptime: ≥ 99%
  • Linear motor gantry system or 6 axis robot system
  • High speed and stable gantry system with linear motor
  • Breakage inspection and quartz boat positioning with vision system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 13000 X6800 X 3000 mm

Diffusion/Annealing/LPCVD loader and unloader

RTA-ARK20-30000-T

Information:

  • Throughput:20000-30000
  • Breakage ratio:0.01%@182;0.02%@210
  • Uptime: ≥ 99%
  • Linear motor gantry system or 6 axis robot system
  • High speed and stable gantry system with linear motor
  • Breakage inspection and quartz boat positioning with vision system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 13000 X6800 X 3000 mm

Diffusion/Annealing/LPCVD loader and unloader

RTA-ARK20-30000-I

Information:

  • Throughput:20000-30000
  • Breakage ratio:0.01%@182;0.02%@210
  • Uptime: ≥ 99%
  • Linear motor gantry system or 6 axis robot system
  • High speed and stable gantry system with linear motor
  • Breakage inspection and quartz boat positioning with vision system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Inline PSG removal

Information:

  • Model:RCL-I 8000/14000
  • Throughput: 8000-14000pcs/hour
  • Breakage ratio:≤0.02%(Silicon wafer size above M10 )
  • Uptime: > 98%

Characteristics:

  • Rear side clean for high efficiencysolar cells, for example PERC & TOPCon
  • PSG/BSG removal
  • Excellent uniformity, long bath life time.
  • High capacity, low cost.

Batch-Alkaline Polish Equipment

Information:

  • Throughput: 8000-15000pcs/hour
  • Breakage ratio: M10< 0.01%/M12<0.02%
  • Uptime: > 98%

Characteristics:

  • Alkaline polish for high efficiencysolar cells, for example PERC and TOPCon
  • Used for polishing, etching and cleaning treatment
  • With dry clean area and self-cleaning system
  • Avoid cross-contamination and reaction overtime
  • Upgrade related materials to avoid precipitation of impurities
  • Intelligent machine, energy consumption, statistical analysis function
  • High throughput、Low CoO
  • Suitable MES and RFID

Layout Size

  • W x D x H
  • 15000 X4500 X 2500 mm

Wet Etch Processing Automation Edge isolation+Polish+PSG removal

RTA-WPA-8000-16000

Information:

  • Model: RTA-WPA-8000-16000
  • Throughput:8000-16000
  • Breakage ratio:0.02%@182;0.03%@210
  • Uptime: ≥ 99%
  • Double wafer detection,breakage inspection and crack detection
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 11000 X 2900 X 2500 mm

PECVD Processing Automation

RTA-PE-4000-9000

Information:

  • Model: RTA-PE-4000-9000
  • Throughput:4000-9000
  • Breakage ratio:0.04%@182;0.05%@210
  • Uptime: ≥ 99%
  • Staubli or Fanuc 6 axis robot
  • Warpage and graphite boat positioning with vision system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 11000 X6000 X 2500 mm

ALD (Plate)

RTA-ALD-6000-16000

Information:

  • Model: RTA-ALD-6000-16000
  • Throughput:6000-16000
  • Breakage ratio:0.04%@182;0.05%@210
  • Uptime: ≥ 99%
  • Intergrated load and unload design
  • Automatic breakage cleaning system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 16000 X3100 X 2500 mm

Tester and Sorter

RTA-SRT-7500

Information:

  • Model: RTA-SRT-8000
  • Throughput:8000@166;7500@182;7200@210
  • Breakage ratio:≤0.06%@166;0.08%@182;0.08%@210
  • Uptime: ≥ 99%
  • Offline and online mode
  • Free grading system
  • AOI/IV/EL front and read inspection
  • All-in-one welded steel frame
  • Single lane and dual lane
  • All-in-one configuration
  • Optional common lanes solution
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Rework washer

Information:

  • Model:RC-I2500/4000
  • Throughput: 2500-4000 pcs/hour
  • Breakage ratio:≤0.01%
  • Uptime: ≥ 98.5%

Characteristics:

  • SixNy&Al2O3 film removal for PERC and TOPCon high efficiency solar cells
  • Flexible process sequence
  • Effective rinsing and drying
  • High throughput、Low CoO
  • Intelligent machine, energy consumption, statistical analysis function

Carrier clean

Information:

  • Model:DC-1.0
  • Throughput : up to 200/400 carriers per day
  • Uptime: ≥ 98%

Characteristics:

  • Automatic carriers cleaning, drying
  • High efficiency cleaning
  • Low CoO

Texturing

1

Diffusion

2

Polishing

3

Passivation

4

Testing

5

Auxiliary

Layout Size

  • W x D x H
  • 5000 X4400 X 2500 mm

Texturing loader and unloader

RTA-WTA-9000-18000

Information:

  • Model: RTA-WTA-9000-18000
  • Throughput:9000-19000
  • Breakage ratio:0.01%@166;0.02%@182;0.03%@210
  • Uptime: ≥ 99%
  • Double wafer detection
  • breakage inspection and crack detection
  • All-in-one welded steel frame%MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Batch Texturing Equipment

Information:

  • Model:ET-V8000/15000
  • Throughput : 8000-15000 pcs/hour
  • Breakage ratio:M10< 0.01%/M12< 0.02%
  • Uptime: >98%

Characteristics:

  • Alkaline texturing for PERC , TOPCon high efficiency solar cells
  • Texturing and cleaning with solar cell
  • Long bath lifetime design
  • Avoid cross-contamination and overtime
  • Upgrade related materials to avoid precipitation of impurities.

Layout Size

  • W x D x H
  • 9700 X 4500 X 2600 mm

Diffusion/Annealing/LPCVD loader and unloader

RTA-DIA12000-U-2R-12

Information:

  • Throughput:12000
  • Breakage ratio:0.01%@182;0.02%@210
  • Uptime: ≥ 99%
  • Linear motor gantry system or 6 axis robot system
  • High speed and stable gantry system with linear motor
  • Breakage inspection and quartz boat positioning with vision system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 13000 X6800 X 3000 mm

Diffusion/Annealing/LPCVD loader and unloader

RTA-ARK20-30000-T

Information:

  • Throughput:20000-30000
  • Breakage ratio:0.01%@182;0.02%@210
  • Uptime: ≥ 99%
  • Linear motor gantry system or 6 axis robot system
  • High speed and stable gantry system with linear motor
  • Breakage inspection and quartz boat positioning with vision system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Inline PSG/BSG removal

Information:

  • Model:RCL-I 8000/14000
  • Throughput: 8000-14000pcs/hour
  • Breakage ratio:≤0.02%(Silicon wafer size above M10 )
  • Uptime: > 98%

Characteristics:

  • Rear side clean for high efficiencysolar cells, for example PERC & TOPCon
  • PSG/BSG removal
  • Excellent uniformity, long bath life time.
  • High capacity, low cost.

Batch-Alkaline Polish Equipment

Information:

  • Throughput: 8000-15000pcs/hour
  • Breakage ratio: M10< 0.01%/M12<0.02%
  • Uptime: > 98%

Characteristics:

  • Alkaline polish for high efficiencysolar cells, for example PERC and TOPCon
  • Used for polishing, etching and cleaning treatment
  • With dry clean area and self-cleaning system
  • Avoid cross-contamination and reaction overtime
  • Upgrade related materials to avoid precipitation of impurities
  • Intelligent machine, energy consumption, statistical analysis function
  • High throughput、Low CoO
  • Suitable MES and RFID

Layout Size

  • W x D x H
  • 18800 X 2950 X 2650 mm

Winding Removal

Information:

  • Model:CB-V8000/1400
  • Throughput : 8000-14000 pcs/hour
  • Breakage Ratio:M6≤0.01%/ M12≤0.02%
  • Uptime: ≥ 98%

Characteristics:

  • Winding removal for TOPCon solar cell
  • Self-clean design
  • Avoid cross contamination and reaction timeout
  • All materials in contact with liquid shall be optimized and upgraded to avoid precipitation of impurities
  • Compatible with MES and RFID functions
  • Intelligent machine, energy consumption, statistical analysis function

Wet Etch Processing Automation Edge isolation+Polish+PSG removal

RTA-WPA-9000-15000

Information:

  • Model: RTA-WPA-9000-15000
  • Throughput:8000-16000
  • Breakage ratio:0.02%@182;0.03%@210
  • Uptime: ≥ 99%
  • Double wafer detection,breakage inspection and crack detection
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 11000 X 2900 X 2500 mm

PECVD Processing Automation

RTA-PE-4000-9000

Information:

  • Model: RTA-PE-4000-9000
  • Throughput:4000-9000
  • Breakage ratio:0.04%@182;0.05%@210
  • Uptime: ≥ 99%
  • Staubli or Fanuc 6 axis robot
  • Warpage and graphite boat positioning with vision system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 11000 X6000 X 2500 mm

ALD (Plate)

RTA-ALD-6000-16000

Information:

  • Model: RTA-ALD-6000-16000
  • Throughput:6000-16000
  • Breakage ratio:0.04%@182;0.05%@210
  • Uptime: ≥ 99%
  • Intergrated load and unload design
  • Automatic breakage cleaning system
  • All-in-one welded steel frame
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 16000 X 3100 X 2500 mm

Tester and Sorter

RTA-SRT-7500

Information:

  • Model: RTA-SRT-8000
  • Throughput:8000@166;7500@182;7200@210
  • Breakage ratio:≤0.06%@166;0.08%@182;0.08%@210
  • Uptime: ≥ 99%
  • Offline and online mode
  • Free grading system
  • AOI/IV/EL front and read inspection
  • All-in-one welded steel frame
  • Single lane and dual lane
  • All-in-one configuration
  • Optional common lanes solution
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Rework washer

Information:

  • Model:RC-I2500/4000
  • Throughput: 2500-4000 pcs/hour
  • Breakage ratio:≤0.01%
  • Uptime: ≥ 98.5%

Characteristics:

  • SixNy&Al2O3 film removal for PERC and TOPCon high efficiency solar cells
  • Flexible process sequence
  • Effective rinsing and drying
  • High throughput、Low CoO
  • Intelligent machine, energy consumption, statistical analysis function

Carrier clean

Information:

  • Model:DC-1.0
  • Throughput : up to 200/400 carriers per day
  • Uptime: ≥ 98%

Characteristics:

  • Automatic carriers cleaning, drying
  • High efficiency cleaning
  • Low CoO

Texturing

1

Intrinsic deposition

2

TCO deposition

3

Copper plating

4

Testing

5

HJT texturing

Information:

  • Model:ET-V8000
  • Throughput: 8000pcs/hour
  • Breakage Ratio:M6< 0.01%/M10< 0.02%
  • Uptime: >95%

Characteristics:

  • High efficiency HJT solar cell Texturing
  • Long bath life time design
  • Avoid cross contamination and reaction timeout
  • Partition design of acid/alkali washing area
  • ESD protection design
  • All materials in contact with liquid shall be optimized and upgraded to avoid precipitation of impurities
  • Compatible with MES and RFID functions
  • Intelligent machine, energy consumption, statistical analysis function

PECVD Automation

Information:

  • Model: RTA-PECVD-3500-9000
  • Throughput:3500-9000
  • Breakage ratio:≤0.05%@166;0.06%@182;0.06%@210
  • Uptime: ≥ 99%

Characteristics:

  • Inline or U shape layout
  • Patened wafer conveyors design to reduce the contact times of wafer
  • Class 1000 clean room design
  • All-in-one welded steel frame
  • High speed and stable gantry system with linear motor
  • High strength carbon fiber gantry design
  • PL,crack detection
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

PVD Automation

Information:

  • Model: RTA-PVD-3500-9000
  • Throughput:3500-9000
  • Breakage ratio:≤0.05%@166;0.06%@182;0.06%@210
  • Uptime: ≥ 99%

Characteristics:

  • Inline or U shape layout
  • Class 1000 clean room design
  • All-in-one welded steel frame
  • High speed and stable gantry system with linear motor
  • PL,crack detection
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer

Layout Size

  • W x D x H
  • 16000 X3100 X 2500 mm

Tester and Sorter

RTA-SRT-7500

Information:

  • Model: RTA-SRT-8000
  • Throughput:8000@166;7500@182;7200@210
  • Breakage ratio:≤0.06%@166;0.08%@182;0.08%@210
  • Uptime: ≥ 99%
  • Offline and online mode
  • Free grading system
  • AOI/IV/EL front and read inspection
  • All-in-one welded steel frame
  • Single lane and dual lane
  • All-in-one configuration
  • Optional common lanes solution
  • MES interface and remote debug
  • Smart IGV interface
  • OEE statistics and energy consumption analysis
  • Compatible with M10,M12 full size and half cut size wafer